发明名称 SEPARATING METHOD AND RECYCLING METHOD OF SUBSTRATE PLACING MEMBER
摘要 PROBLEM TO BE SOLVED: To provide a separating method of a substrate placing member for separating a base member and an electrostatic chuck in a short time without giving a scratch to the base member, etc., and to provide the recycling method of the separated base member and the electrostatic chuck. SOLUTION: The separating method of the substrate placing member separates the above-mentioned electrostatic chuck 5 and the base member 3 from the substrate placing member 1 joining the electrostatic chuck 5 and the base member 3 through an organic adhesive layer 7. The above-mentioned electrostatic chuck 5 is suspended to a support 35 while the above-mentioned substrate placing member 1 is heated to the thermal decomposition point of the dimensions from the thermal decomposition origination temperature to the thermal decomposition end temperature while softening the above-mentioned organic adhesive layer 7 and decomposing, and separated by adding a separating load by the prudence of the base member 3. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007129142(A) 申请公布日期 2007.05.24
申请号 JP20050322193 申请日期 2005.11.07
申请人 NGK INSULATORS LTD 发明人 EGUCHI MASATO
分类号 H01L21/683;H01L21/3065 主分类号 H01L21/683
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