Method of forming a multilayer structure by electroetching or electroplating on a substrate. A seed layer is arranged on the substrate and a master electrode is applied thereto. The master electrode has a pattern layer forming multiple electrochemical cells with the substrate. A voltage is applied for etching the seed layer or applying a plating material to the seed layer. A dielectric material (9) is arranged between the structures (8) thus formed. The dielectric layer is planarized for uncovering the structure below and another structure layer is formed on top of the first. Alternatively, the dielectric layer is applied with a thickness two layers and the structure below is accessed by selective etching of the dielectric layer for selectively uncovering the top surface of the structure below. Multiple structure layer may also be formed in one step.
申请公布号
WO2007058603(A1)
申请公布日期
2007.05.24
申请号
WO2006SE01319
申请日期
2006.11.20
申请人
REPLISAURUS TECHNOLOGIES AB;FREDENBERG, MIKAEL;MOELLER, PATRIK;WIWEN-NILSSON, PETER
发明人
FREDENBERG, MIKAEL;MOELLER, PATRIK;WIWEN-NILSSON, PETER