发明名称 RESIN COATED BONDING WIRE, METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE
摘要 An electrically conductive base wire is coated with an insulating film of a polymeric material such as aromatic polyester, polyimide, polyether ether ketone, polyamide, polysulfone, or liquid crystalline polymer. The obtained insulator-coated bonding wire is characterized in that no crack develops in the insulation film when an impact of 1cm.gf is given thereto using a falling weight. Further, a method of producing this wire and a semiconductor device using the wire are disclosed.
申请公布号 KR940008555(B1) 申请公布日期 1994.09.24
申请号 KR19900072530 申请日期 1990.03.27
申请人 NIPPON STEEL CORP. 发明人 KIMURA, MASAO
分类号 H01B3/30;H01B3/42;H01L21/60;H01L23/49;H01L23/495 主分类号 H01B3/30
代理机构 代理人
主权项
地址