CIRCUIT BOARD INCLUDING SOLDER BALL LAND HAVING HOLE AND SEMICONDUCTOR PACKAGE HAVING THE BOARD

摘要

A circuit board and a semiconductor package having the same are provided. The circuit board comprises a base substrate having interconnections, and solder ball lands disposed on one surface of the base substrate. The solder ball lands respectively have land holes having different sizes. The land hole disposed at the center portion of the base substrate and the land hole disposed at the edge portion of the base substrate may have different sizes. For example, the sizes of the land holes may increase from the center portion of the base substrate to the edge portion thereof, and alternatively, the sizes of the land holes may decrease from the center portion of the base substrate to the edge portion thereof.