| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed circuit board suitable for use in a multilayer structure, and also to provide a semiconductor device. <P>SOLUTION: The printed wiring board comprises a first buildup layer 20 and a second buildup layer 40. In the first buildup layer 20, a plurality of wiring layers 24, 26, and 28 and a plurality of insulating layers 23, 25, and 27 are laminated alternately; the wiring layers 24, 26, and 28 are connected to each other by vias; and the via diameters are larger in the first surface mounted with a semiconductor element 60 than in the second surface opposite to the first surface. In the second buildup layer 40, a plurality of wiring layers 44, 46, and 48 and a plurality of insulating layers 43, 45, and 47 are laminated alternately; the wiring layers 44, 46, and 48 are connected to each other by vias; and the via diameters are larger in the first surface than in the second surface. The second buildup layer 40 is bonded to the second surface of the first buildup layer 20. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
