| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a highly reliable surface-mounted semiconductor package capable of preventing a decrease in adhesion with a protective film or an occurrence of corrosion caused by an entering of water at a pad, for instance, a probing pad or the like other than the pad where an outgoing wire is formed. <P>SOLUTION: External terminals 4a electrically connected to a semiconductor chip are formed in a semiconductor device which size is approximately same as that of the semiconductor chip. An outgoing wire from the predetermined pad 2 of an Al wire layer formed on the semiconductor chip to the external terminal 4a is formed by a rewiring layer 4, and the rewiring layer 4 is formed on a pad 3 other than the pad 2 on which the outgoing wire is formed as a cover layer. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
