发明名称 ULTRA LOW DENSITY THERMALLY CLAD MICROSPHERES
摘要 Microsphere beads are mixed with a surface barrier solid, liquid or mixture of such a liquid with a solid effective to prevent agglomeration and surface bonding of the microspheres; by the control of the application of heat and balancing temperature and active mixing, removal of water from and expansion of the microsphere is achieved. Microsphere densities of as low as 0.005 to less than 0.015 g/cm<SUP>3 </SUP>are realized. The surface barrier solid, liquid or mixture of such a liquid with a solid in the present invention is any one of a wide diversity of materials which meet the requirements of the intended function, i.e., to prevent the agglomeration of the microspheres during the process. Suitable materials include, by way of example, fillers, pigments, plasticizers, diluents, extenders, monomers and oligomers and the like.
申请公布号 KR20070053202(A) 申请公布日期 2007.05.23
申请号 KR20077001214 申请日期 2005.06.10
申请人 HENKEL CORPORATION 发明人 JOHNSTON RICHARD W.;CLARK RICHARD F.
分类号 C08J9/32;B01J13/14;B32B5/16;B32B27/00;C08J7/04;C08J9/224 主分类号 C08J9/32
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