发明名称 SYSTEM AND METHOD FOR ELECTROPLATING FLEXIBLE SUBSTRATES
摘要 A processing system for processing flexible substrates is disclosed. The system includes a loading station having an input spool adapted to support a wounded, unprocessed flexible substrate; a processing station adapted to perform one or more predetermined processes on the flexible substrate; an unloading station having an output spool adapted to receive the processed flexible substrate; and a substrate stability subsystem adapted to maintain the flexible substrate in a substantially vertical orientation while the substrate undergoes the one or more processes performed by the processing station. The substrate stability subsystem includes movable upper clips adapted to engage with upper portions of the flexible substrate, and a plurality of lower clips adapted to engage with lower portions of the flexible substrate as it is being transported into and out of the processing station. Also disclosed is a unique shield for the cathode clips to improve the uniformity of the deposition formed on the flexible substrate, and a unique seal to allow the transportation of the lower clips into and out of the electroplating cell while reducing leakage of fluid from the cell.
申请公布号 KR20070053084(A) 申请公布日期 2007.05.23
申请号 KR20060018396 申请日期 2006.02.24
申请人 TECHNIC, INCORPORATED 发明人 JACKSON DALE EDWARD;SOURIVONGS KAM;HARRIS JOHN SCOTT;NELSON BOYD
分类号 C25D17/04;C25D7/06 主分类号 C25D17/04
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