发明名称 |
SOLDER COMPOSITION, CONNECTING PROCESS WITH SOLDERING, AND CONNECTION STRUCTURE WITH SOLDERING |
摘要 |
<p>There is provided a solder composition which contains: (1) a metal material comprising solder particles, and (2) a thermosetting flux material comprising a thermosetting resin and a solid resin which changes to be in its liquid-like state when heated with a proviso that the thermosetting resin is excluded from the solid resin, wherein a temperature at which the solid resin changes to be in the liquid-like state is lower than a temperature at which the thermosetting resin starts to cure.</p> |
申请公布号 |
EP1786592(A2) |
申请公布日期 |
2007.05.23 |
申请号 |
EP20050781438 |
申请日期 |
2005.08.24 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
WADA, YOSHIYUKI;SAKAI, TADAHIKO;YOSHINAGA, SEIICHI TD |
分类号 |
B23K35/36;B23K1/20;B23K35/26;C22C12/00 |
主分类号 |
B23K35/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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