| 摘要 |
<p>A support structure (18) within an interferometric modulator device may contactvarious other structures within the device. Increased bond strengths betweenthe support structure (18) and the other structures may be achieved in variousways, such as by providing roughened surfaces and/or adhesive materials at theinterfaces between the support structures and the other structures. In an embodiment,increased adhesion is achieved between a support structure (18) and a substratelayer (20). In another embodiment, increased adhesion is achieved between asupport structure (18) and a moveable layer (14). Increased adhesion may reduceundesirable slippage between the support structures and the other structuresto which they are attached within the interferometric modulator.</p> |
