发明名称 ELECTRICAL CONTACT ENCAPSULATION
摘要 An electronic device comprises a substrate and an electrical contact in contact with the dielectric layer and electrically coupled with at least one resistor, a substrate carrier including an electrical trace electrically coupled to the electrical contact, a polymer enclosing the electrical contact, and a substantially planar film disposed over the electrical contact.
申请公布号 EP1786627(A2) 申请公布日期 2007.05.23
申请号 EP20050773571 申请日期 2005.07.22
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 BENSON, BRAD;BRETL, FRANK J.;CHAPPELL, ELLEN L.;IGELMAN, M. JEFFERY;ZHANG, STEVE H.
分类号 B41J2/14 主分类号 B41J2/14
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