发明名称 Multiple component field-replaceable active integrated liquid pump heat sink module for thermal management of electronic components
摘要 A field-replaceable active pumped liquid heat sink module includes a front portion and a back portion, each including a liquid pump, a radiator, an optional receiver, and a cold plate heat exchanger, all of which are connected together in a liquid pump loop through which a coolant such as water is circulated. The liquid pump, radiator, optional receiver and cold plate heat exchanger are in a liquid pump loop and are self-contained in a field-replaceable active pumped liquid heat sink module.
申请公布号 US7219714(B1) 申请公布日期 2007.05.22
申请号 US20050196963 申请日期 2005.08.04
申请人 SUN MICROSYSTEMS, INC. 发明人 HEYDARI ALI
分类号 F28F7/00;H05K7/20 主分类号 F28F7/00
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