| 摘要 |
The present invention relates to a condenser microphone, and more particularly to a silicon condenser microphone having an additional back chamber. The silicon condenser microphone in accordance with the present invention comprises a case having a sound hole; a substrate including a chamber case, a MEMS chip having an additional back chamber formed by the chamber case, a ASIC chip for operating the MEMS chip, and a conductive pattern for bonding to the case; a fixing means for fixing the case to the substrate; and an adhesive for bonding the case and the substrate, wherein the adhesive is applied to an entirety of a bonding surface of the case and the substrate fixed by the fixing means. |
