发明名称 |
Substrate for mounting semiconductor chip, mounting structure of semiconductor chip, and mounting method of semiconductor chip |
摘要 |
A substrate for mounting a semiconductor chip is formed as a multilayer substrate by alternately laminating insulation layers and wiring layers. Wires of the wiring layers are electrically connected through a via-hole for interlayer continuity. A through-hole provided through the insulation layer of the outermost surface layer is formed. A bump is inserted in the through-hole to a bump allocating position of the semiconductor chip to be mounted in the insulation layer of the outermost surface layer. A portion of the wire in the wiring layer of the outermost surface layer is projected to the internal side of through-hole at the aperture of the through-hole.
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申请公布号 |
US7221058(B2) |
申请公布日期 |
2007.05.22 |
申请号 |
US20040950400 |
申请日期 |
2004.09.28 |
申请人 |
DENSO CORPORATION |
发明人 |
KASHIWAZAKI ATSUSHI |
分类号 |
H01L23/12;H01L23/48;H01L21/60;H01L23/498;H01L23/52;H01L29/40;H05K3/32;H05K3/34;H05K3/40 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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