发明名称 |
Curing method and apparatus |
摘要 |
The present invention provides a method for curing a light curable sealant in an article. The article includes opposing first and second substrates. The light curable sealant is used to attach the first substrate to the second substrate. The method includes irradiating steps (a) and (b). In the step (a), the article is irradiated by a light entering the article from the first substrate to reach the light curable sealant. In the step (b), the article is irradiated by a light entering the article from the second substrate to reach the light curable sealant. The present invention further provides curing apparatuses for accomplishing the aforementioned method.
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申请公布号 |
US7221428(B2) |
申请公布日期 |
2007.05.22 |
申请号 |
US20030743456 |
申请日期 |
2003.12.23 |
申请人 |
CHI MEI OPTOELECTRONICS CORP. |
发明人 |
PAN CHENG CHE;PARK SUNG SOO |
分类号 |
G02F1/1335;G02F1/1339;G02F1/1345;G09F9/00;H04N5/66 |
主分类号 |
G02F1/1335 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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