发明名称 |
Tilted land grid array package and socket, systems, and methods |
摘要 |
A electrical interface for an electronic package, using lands on the package which are non-planar with metal layers within the package. This non-planar or tilted land grid array (TLGA) package is assembled with a complementary TLGA socket to make electronic connection to the package.
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申请公布号 |
US7220132(B2) |
申请公布日期 |
2007.05.22 |
申请号 |
US20040880149 |
申请日期 |
2004.06.28 |
申请人 |
INTEL CORPORATION |
发明人 |
STONE BRENT S.;WALK MICHAEL J. |
分类号 |
H01R12/00;H05K7/10 |
主分类号 |
H01R12/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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