发明名称 Tilted land grid array package and socket, systems, and methods
摘要 A electrical interface for an electronic package, using lands on the package which are non-planar with metal layers within the package. This non-planar or tilted land grid array (TLGA) package is assembled with a complementary TLGA socket to make electronic connection to the package.
申请公布号 US7220132(B2) 申请公布日期 2007.05.22
申请号 US20040880149 申请日期 2004.06.28
申请人 INTEL CORPORATION 发明人 STONE BRENT S.;WALK MICHAEL J.
分类号 H01R12/00;H05K7/10 主分类号 H01R12/00
代理机构 代理人
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