Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern, and method for producing printed wiring board

摘要

The present invention provides a photosensitive resin composition for laser scanning exposure, which satisfies the following formula (1): $\begin{array}{cc}-25<=\frac{E_1-E_0}{E_0}x100<=25& \left(1\right)\end{array}$ wherein E₀ represents an exposure amount in mJ/cm² at which the photosensitive resin composition is cured at the 21st step of the density 1.00 of a 41-step step tablet having a density range from 0.00 to 2.00, a density step of 0.05, a tablet size of 20 mmx187 mm and a step size of 3 mmx12 mm, by irradiation with a full wavelength active light of a high pressure mercury lamp and E₁ represents an exposure amount in mJ/cm² at which the photosensitive resin composition after being left for 2 hours under 40 W non-ultraviolet white lamp is cured at the 21st step of the 41-step step tablet by irradiation with a full wavelength active light from a high pressure mercury lamp.