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发明名称
FLIP CHIP PACKAGE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要
申请公布号
KR20070052518(A)
申请公布日期
2007.05.22
申请号
KR20050110233
申请日期
2005.11.17
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
PARK, SUNG EUN;SHIN, YOUNG HWAN;LEE, HYO SOO;KIM, SANG WOOK
分类号
H01L21/60
主分类号
H01L21/60
代理机构
代理人
主权项
地址
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