APPARATUS AND METHOD FOR BONDING PRINTED CIRCUIT ON FPD PANEL

摘要

The invention discloses an apparatus for providing drive circuit board and cassette case thereof, bonding apparatus and bonding method of drive circuit board, and bonding system of drive circuit board comprising the bonding apparatus. Bonding apparatus of drive circuit board includes a compression unit for compressing the drive circuit board onto bonding surface attached with underlay of drive circuit board, wherein the compression unit includes a compression body provided for closing to bonding surface on top of the underlay and separating from the bonding surface; a bonding tool comprising a pressure surface, when the drive circuit is compressec onto the bonding surface, the pressure surface contacting with the drive circuit board; a plurality of height regulation components for regulating displacement of the pressure surface relative to the bonding surface to obtain planarity of pressure surface of the bonding tool; and rotation regulation parts provided on the height regulation components for regulating rotation of the height regulation component and provided on a area between the compression body and the bonding tool of the height regulation component.