发明名称 NONPLANAR DEVICE WITH THINNED LOWER BODY PORTION AND METHOD OF FABRICATION
摘要 <p>A nonplanar semiconductor device having a semiconductor body formed on an insulating layer of a substrate. The semiconductor body has a top surface opposite a bottom surface formed on the insulating layer and a pair of laterally opposite sidewalls wherein the distance between the laterally opposite sidewalls at the top surface is greater than at the bottom surface. A gate dielectric layer is formed on the top surface of the semiconductor body and on the sidewalls of the semiconductor body. A gate electrode is formed on the gate dielectric layer on the top surface and sidewalls of the semiconductor body. A pair of source/drain regions are formed in the semiconductor body on opposite sides of the gate electrode.</p>
申请公布号 KR20070052337(A) 申请公布日期 2007.05.21
申请号 KR20077007396 申请日期 2007.03.30
申请人 INTEL CORP. 发明人 SHAH UDAY;DOYLE BRIAN;BRASK JUSTIN;CHAU ROBERT;LETSON THOMAS
分类号 H01L29/78;H01L21/336 主分类号 H01L29/78
代理机构 代理人
主权项
地址