| 摘要 |
FIELD: manufacturing of electronic equipment; printed circuit boards. ^ SUBSTANCE: method for manufacturing of printed circuit boards includes the following operations: drilling holes in a dielectric workpiece, its surface preparation and metal deposition on its dielectric base and hole surfaces performed by vapour decomposing of metal carbonyls of the first group, e.g., such as Cu2(CO)6, CuCO, Cu(CO)2, Cu(CO)3 and others of said group, according to their chemical properties, at 1.10-1 mm of mercury column in vacuum. Alternatively the process is carried out in hydrogen, nitrogen or argon when said gases are used as carrier gases and are transferred from an evaporator to a reactor wherein workpieces of printed circuit boards are placed. Moreover, the process of metal deposition on the dielectric base and hole surfaces is carried out sequentially in response to computer commands and according to the printed circuit pattern: source metal carbonyl of the first group, being heated up to a required temperature, evaporates under pressure via cartridge nozzles of a supplying head, the vapour is transferred and supplied to the workpieces of printed circuit boards heated to a temperature whereat the vapour thermally dissociates, then adsorption-desorption reactions, nucleation and metal deposition to a required thickness take place on the surface of printed circuit boards workpieces with the result that a pattern of the printed circuit board appears on its dielectric workpiece. Another proposed alternate method for making a printed circuit board includes the following operations: drilling holes in a dielectric workpiece, its surface preparation whereby metal deposition on its dielectric base and hole surfaces is performed in a laser-type reproducing device whereon metal particles are electrically attracted, and said metal particles are electrically charged by means of a laser beam in response to computer commands and according to the printed circuit pattern. ^ EFFECT: reduction of the terms of manufacturing of printed circuit boards, manufacturing cost saving. ^ 5 cl |
