MICROELECTRONIC PACKAGES AND METHODS THEREFOR

摘要

A microelectronic package (90) includes a microelectronic element (62) having faces, contacts and an outer perimeter, and a flexible substrate (42) overlying and spaced from a first face of the Microelectronic element (62), an outer region (86) of the flexible substrate (42) extending beyond the outer perimeter of the Microelectronic element (62). The package (90) includes a plurality of conductive posts (40a-40f) exposed at a surface of the flexible substrate (42) and being electrically interconnected with the microelectronic element (62), whereby at least one of the conductive posts (40a-40f) is disposed in the outer region (86) of the flexible substrate (42), and a compliant layer (74) disposed between the first face of the microelectronic element (62) and the flexible substrate (42), wherein the compliant layer (74) overlies the at least one of the conductive posts that is disposed in the outer region (86) of the flexible substrate (42). The package includes a support element (84) in contact with the microelectronic element (62) and the compliant layer (74), whereby the support element 84 overlies the outer region (86) of the flexible substrate (42).