发明名称 |
SOLDERING ALLOY |
摘要 |
A new soldering technique and solder alloy for wetting and joining hard-to-wet materials including titanium alloys such as nitinol uses a solder alloy containing tin and an active wetting promoting element such as aluminum in the presence of ultrasound. As shown in the Figure, molten solder alloy (10) is applied to the hard-to-wet material (18) with the application of ultrasonic energy (14) which removes coatings (20) such as tenacious surface oxides to leave the base material (18) which is readily wetted by the solder alloy (20). |
申请公布号 |
WO0062969(A3) |
申请公布日期 |
2007.05.18 |
申请号 |
WO2000US10223 |
申请日期 |
2000.04.14 |
申请人 |
EDISON WELDING INSTITUTE;HALL, PETER |
发明人 |
HALL, PETER |
分类号 |
B23K31/02;B23K1/06;B23K1/08;B23K1/19;B23K3/02;B23K3/06;B23K20/16;B23K35/26;C04B37/00;C04B37/02 |
主分类号 |
B23K31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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