| 摘要 |
The present invention relates to a method for producing electrical bushings through non-conductive or semiconductive substrates, which are particularly suitable for electrical applications. The method is characterized in that a semiconductor substrate or a non-conductive substrate (13) whose front side has an electrically conductive contact point (6) at at least one location is provided with a recess (7) from its rear side such that the recess (1) on the front side of the substrate ends under that location or one of the locations at which the electrically conductive contact point or one of the electrically conductive contact points is situated and is completely covered by the latter, to which an electrically conductive structure (9) which establishes a conductive connection between the respective contact point and the rear-side surface (10, 11, 12) of the substrate through the recess or at least one of the recesses is applied from the rear side of the substrate. The invention also relates to substrates and components having a design that is predetermined by the method according to the invention. |
