RECLAIMING SUBSTRATES HAVING DEFECTS AND CONTAMINANTS
摘要
<p>Test substrates used to test semiconductor fabrication tools are reclaimed by reading from a database the process steps performed on each test substrate and selecting a reclamation process from a plurality of reclamation processes. The reclamation process can include crystal lattice defect or metallic contaminant reduction treatments for reclaiming each test substrate. Each test substrate is sorted and placed into a group of test substrates having a common defect or contaminant reduction treatment assigned to the test substrates of the group. Additional features are described and claimed.</p>
申请公布号
WO2007056025(A2)
申请公布日期
2007.05.18
申请号
WO2006US42702
申请日期
2006.10.31
申请人
APPLIED MATERIALS, INC.;VEPA, KRISHNA;BHATNAGAR, YASHAJ;RAYANDAYAN, RONALD;WANG, HONG
发明人
VEPA, KRISHNA;BHATNAGAR, YASHAJ;RAYANDAYAN, RONALD;WANG, HONG