发明名称 BOITIER MICROELECTRONIQUE MULTIPLANS
摘要 The box has an intermediate structure (12) installed on lower and upper stages (13, 11) and comprising metallic channels. Microelectronic printed circuits of the stages (11, 13) and the structure are made up of organic material. The channels are interconnected with connection points of the circuits of the stages (11, 13) such that the stages (11, 13) are interconnected during assembling of the box.
申请公布号 FR2877537(B1) 申请公布日期 2007.05.18
申请号 FR20040011607 申请日期 2004.10.29
申请人 THALES SOCIETE ANONYME 发明人 RANANJASON VALERIE;BARBIER THIERRY;PREDON ERIC;NADAL GHYSLAIN
分类号 H05K1/11;H01L25/10;H05K3/36 主分类号 H05K1/11
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