COOLING ASSEMBLY

摘要

In a method for cooling an electronic application (1; 101) having at least one heat-generating electronic component (3) mounted on a circuit board (2), a heat sink (6) is attached to the circuit board in heat transferring thermal contact (6T, 3T) with one heat generating electronic component (3) by first being statically fixed to the circuit board in a stationary position at a specified height (L) above said circuit board and by then being resiliently biasing the component against the heat sink.