LEADFRAME-BASED IC-PACKAGE WITH SUPPLY-REFERENCE COMB

摘要

An IC package includes a leadframe-diepad (112) and a supply -reference comb (114) for interconnecting a die (110) and the package I/O pins (124) in a manner that facilitates substantially ideal EMC performance. The leadframe-diepad includes a diepad- finger (118) and an elongated portion. The leadframe-diepad and the diepad-finger are connected to ground-reference bondpads (128). The supply- reference comb has an elongated spine portion (120) and a finger that is arranged very close to and along the elongated portion of the leadframe-diepad and the diepad-finger respectively for facilitating electromagnetic coupling therebetween and for facilitating local tying of return currents. The supply-reference comb also has a plurality of fingers (116) extending outwardly from the elongated spine portion in a substantially common direction that provides sufficient space in between the fingers for the I/O pins.