发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 <p>A substrate processing apparatus in which plasma discharge electrodes having flexibility can be easily placed in predetermined positions in electrode protector tubes, and the plasma discharge electrodes having the flexibility can be kept in the predetermined positions even in use. The substrate processing apparatus comprises a processing chamber housing a plurality of substrates in a state where they are stacked at intervals, a gas supply means for supplying a desired gas into the processing chamber, an exhaust means for discharging the atmosphere in the processing chamber, electrodes which are so placed as to extend in the stack direction of the substrates and which have flexibility, protector tubes housing the respective electrodes, a first mounting member secured to the end of the electrodes, and a second mounting member provided to the end of each of the protector tubes. The electrodes are housed into the protector tubes in a state where the first mounting member and the second mounting member are joined together.</p>
申请公布号 WO2007055138(A1) 申请公布日期 2007.05.18
申请号 WO2006JP321875 申请日期 2006.11.01
申请人 HITACHI KOKUSAI ELECTRIC INC.;SUDA, ATSUHIKO 发明人 SUDA, ATSUHIKO
分类号 H01L21/205;C23C16/509;H01L21/3065 主分类号 H01L21/205
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