| 发明名称 |
A SEMICONDUCTOR PACKAGE THAT INCLUDES STACKED SEMICONDUCTOR DIE |
| 摘要 |
A semiconductor package that includes at least two semiconductor devices that are coupled to one another through a conductive clip. |
| 申请公布号 |
WO2007056253(A2) |
申请公布日期 |
2007.05.18 |
| 申请号 |
WO2006US43143 |
申请日期 |
2006.11.03 |
| 申请人 |
INTERNATIONAL RECTIFIER CORPORATION;MONTGOMERY, ROBERT |
发明人 |
MONTGOMERY, ROBERT |
| 分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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