| 摘要 |
It is possible to provide a semiconductor device in which the cost of wires is reduced and preferable bonding is obtained so as to improve the shape and shape retention capability of the loops. The semiconductor device (10) is formed by a primary bonding (A) for connecting wires (13) to a lead frame (11) and a secondary bonding (B) for connecting the wires (13) to bonding pads (16) on a semiconductor chip (12) while forming a loop (R). In the semiconductor device (10), copper or copper alloy wires are employed for the wires (13) and gold or gold alloy bumps (17) are formed on the bonding pads (16) on the semiconductor chip (12). |
