发明名称 MULTI-STEP SYSTEM AND METHOD FOR CURING A DIELECTRIC FILM
摘要 A multi-step system and method for curing a dielectric film in which the system includes a drying system configured to reduce the amount of contaminants, such as moisture, in the dielectric film. The system further includes a curing system coupled to the drying system, and configured to treat the dielectric film with ultraviolet (UV) radiation and infrared (IR) radiation in order to cure the dielectric film.
申请公布号 WO2007055849(A2) 申请公布日期 2007.05.18
申请号 WO2006US39260 申请日期 2006.10.06
申请人 TOKYO ELECTRON LIMITED;LIU, JUNJUN;LEE, ERIC, M.;TOMA, DOREL, L. 发明人 LIU, JUNJUN;LEE, ERIC, M.;TOMA, DOREL, L.
分类号 H01L21/00 主分类号 H01L21/00
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