| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board wherein metal layers do not contain lead that threatens human health, no functional defect such as stain-like discoloration occurs, and plated layers have high adhesiveness. <P>SOLUTION: In this wiring board 4, wherein wiring conductors 2 are formed of a high melting-point metal on an insulating body 1 and metal layers 6 are formed by electroless plating on the wiring conductors 2, the metal layers 6 contain metal particles of a group IB element 8 distributed on the wiring conductors 2 at a nuclear density of 10-200 nuclei/μm<SP>2</SP>. The wiring board 4 does not threat human health, because it does not contain lead. The metal layers 6 exhibit a fine and high-density initial deposition, and are free of defects, homogeneous, and high in adhesiveness, because the nuclear density of the metal particles of the group IB element 8 is appropriately set at 10-200 nuclei/μm<SP>2</SP>. <P>COPYRIGHT: (C)2004,JPO</p> |
