| 摘要 |
<p>A thermoelectric module having areas of highly thermally conductive material integrated into a substrate layer. For one embodiment copper pads are integrated into the external surface of the substrate of the hot side of the thermoelectric module. The copper pads allow direct connection of a heat removal device to the thermoelectric module thereby reducing thermal resistance. Thermal vias may be formed through the substrate to further reduce thermal resistance.</p> |
