Cooling device for electronic unit, e.g. processor, has contact surface thermally connected with cooling fin by using wall, and ventilation unit provided in contact surface, where wall forms form-fit connection with printed circuit board
摘要
<p>The device has a contact surface (18) that is thermally connected with a cooling fin (12) and is bought in contact with an electronic unit (2) e.g. processor. A soldering paste is applied on the contact surface and stays contact with a heat sink of the electronic unit for providing a firmly-bonded connection between the contact surface and the heat sink. A ventilation unit having a number of ventilation ducts (26) is provided in the contact surface. The fin is connected with the surface by a wall (8) that forms a form-fit connection with a printed circuit board (4).</p>
