| 摘要 |
In a resin-sealed semiconductor device, a semiconductor chip is mounted to a bed having a greater surface than that of the semiconductor chip. A lead section is comprised of a plurality of leads having their forward end portions arranged at given intervals around the semiconductor chip over the bed. The respective lead is connected by the tie bar to the bed. The bed, semiconductor chip, tie bars and portions of the leads are resin-sealed in a mold in such a way that a given surface side of the bed is exposed to an outside. |
