发明名称 |
A method of manufacturing a surface acoustic wave apparatus |
摘要 |
<p>A method of manufacturing a surface acoustic wave apparatus includes the steps of bump-bonding a surface acoustic wave element (20) and a base member (10) together through metal bumps (51) having a melting point of about 450 DEG C or higher such that the surface acoustic wave element (20) is fixed in a face down configuration to a bottom surface of a recess of the base member (10); and bonding a cap member (30) and the base member (10) with a wax material (20) by heating the cap member (30) and the base member (10) uniformly at a temperature higher than a melting point of the wax material to melt the wax material. <IMAGE></p> |
申请公布号 |
EP1033810(B1) |
申请公布日期 |
2007.05.16 |
申请号 |
EP20000400562 |
申请日期 |
2000.03.02 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
TAGA, SHIGETO |
分类号 |
H01L23/02;H03H9/05;H03H3/08;H03H9/02;H03H9/145 |
主分类号 |
H01L23/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|