发明名称 |
Epoxy resin composition for sealing photo-semiconductor element and photo-semiconductor device sealed with the epoxy resin composition |
摘要 |
An epoxy resin composition for sealing a photo-semiconductor element, comprising (A) an epoxy resin, (B) a curing agent and (C) a polyether-modified silicone oil which is represented by the following general formula (1) wherein m, n and a are each independently a number of 1 or more, b is 0 or a positive number, and R is an alkyl group of 1 to 6 carbon atoms or H, and has a weight average molecular weight of 1,000 to 100,000, a silicone unit content {[(m+n+2)/(m+n+2+a+b+1)]x100} of 10 to 60% and a polyether unit content {[(a+b+1)/(m+n+2+a+b+1)]x100} of 40 to 90% and a photo-semiconductor device produced by sealing a photo-semiconductor element with the epoxy resin composition.
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申请公布号 |
US5985954(A) |
申请公布日期 |
1999.11.16 |
申请号 |
US19970985208 |
申请日期 |
1997.12.02 |
申请人 |
HTIACHI CHEMICAL COMPANY, LTD. |
发明人 |
TSUCHIDA, SATORU;OSAKA, MASAHIKO |
分类号 |
C08L63/00;C08G59/40;C08K3/34;C08L63/02;C08L83/12;H01L23/29;H01L23/31;H01L31/02;H01L33/56;(IPC1-7):C08K3/34 |
主分类号 |
C08L63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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