发明名称 |
Coating solution for forming adhesion reinforcing layer and method of manufacturing a semiconductor device |
摘要 |
The present invention aims at providing: a material for forming an adhesion reinforcing layer which can reinforce the adhesion between a low dielectric constant film, especially a low dielectric constant film containing an inorganic material, and other members; an adhesion reinforcing layer formed by the said material and exhibits superior adhesion; a fast and highly reliable semiconductor device having the adhesion reinforcing layer; and a manufacturing method thereof. The material for forming an adhesion reinforcing layer contains at least any one of organoalkoxysilane having a basic functional group, a basic additive and organoalkoxysilane. The adhesion reinforcing layer is formed by the said material. The manufacturing method of a semiconductor device includes a process for forming a low dielectric constant film and, at least before or after the process for forming a low dielectric constant film, a process for forming an adhesion reinforcing layer with the said material. |
申请公布号 |
EP1786028(A1) |
申请公布日期 |
2007.05.16 |
申请号 |
EP20060007728 |
申请日期 |
2006.04.12 |
申请人 |
FUJITSU LTD. |
发明人 |
KON, JUNICHI;YANO, EI;NAKATA, YOSHIHIRO;IMADA, TADAHIRO |
分类号 |
H01L21/312;C08G77/08;C09D183/04;H01L21/02 |
主分类号 |
H01L21/312 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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