| 摘要 |
A composite wiring board includes a ceramic substrate (1), a resin layer (2, 3) in contact with at least one surface of the ceramic substrate and a sintered metal conductor (6) piercing through the resin layer. The composite wiring board is manufactured by a method including the steps of forming a through hole in a sheet (17) having a shrinkage-suppressing effect and filling the through hole with conductive paste (18) to obtain a sheet (15, 16, 61, 71, 81, 82) for formation of a conductor, firing the conductor formation sheet and a green sheet (11) for a substrate in their laminated state to obtain a ceramic substrate having a surface provided with a sintered metal conductor (6), removing from the surface of the ceramic substrate a fired product of the sheet having the shrinkage-suppressing effect and forming a resin layer (2, 3) on the surface of the ceramic substrate. |
