发明名称
摘要 <p>&lt;P&gt;PROBLEM TO BE SOLVED: To provide a process parameter creating method that can obtain a desired pattern. Ž&lt;P&gt;SOLUTION: The method has a step to prepare a parameter group containing a plurality of process parameters, a step to obtain a second pattern by correcting the first parameters on the basis of the parameter group, a step to forecast a third pattern to be formed on a semiconductor substrate by etching on the basis of the parameter group and the second parameters, a step to obtain an evaluation result by comparing the third pattern and the first pattern, a step to determine if the evaluation result satisfies a predetermined condition, a step, if not, to return to the step to correct the first pattern by correcting the process parameters in the parameter group, and a step, if satisfied, to decide the process parameters in the parameter group as the final process parameters. Ž&lt;P&gt;COPYRIGHT: (C)2004,JPO Ž</p>
申请公布号 JP3914085(B2) 申请公布日期 2007.05.16
申请号 JP20020109311 申请日期 2002.04.11
申请人 发明人
分类号 H01L21/00;G03F1/36;G03F1/68;G03F1/70;G03F7/20;H01L21/02;H01L21/027 主分类号 H01L21/00
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