| 摘要 |
A process for producing a thick-film hybrid, comprises the steps of: providing a ceramic substrate 1; printing at least one thick-film conducting layer 2 onto the substrate to form a conductive pattern on the substrate, the pattern comprising at least one conductive pad located for subsequent connection to an electrical component; covering at least a portion of the thick-film conductor with an insulating overglaze 3, leaving each pad uncovered by the overglaze; metallising the pads 4; and electrically connecting electrical components 7 to the metallised pads. The hybrid produced is suitable for use at ambient temperatures above 150{C. A printed resistor may also be formed. The pads may be metallised with layers of nickel and gold. Components 7 may be attached to the pads by solder, conducting adhesive, ultrasonically bonded aluminium wire or micro-welded nickel strips. |
