发明名称 VERFAHREN ZUM EINBRINGEN VON DURCHBRECHUNGEN IN EIN SUBSTRAT
摘要 <p>The substrate is positioned by a holding frame during processing. The method involves determining coordinates of a reference point in a central region, spaced apart from the holding frame. The spacing between the respective positions of the openings and the reference point is determined and used to derive the order of the spacings from the reference point. This order is used in a processing program when the openings are formed.</p>
申请公布号 AT359172(T) 申请公布日期 2007.05.15
申请号 AT20050015017T 申请日期 2005.07.11
申请人 LPKF LASER & ELECTRONICS AKTIENGESELLSCHAFT 发明人 WENKE, STEPHAN
分类号 (IPC1-7):B41C1/14 主分类号 (IPC1-7):B41C1/14
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