发明名称 Locking device for heat dissipating device
摘要 A locking device for mounting a heat dissipating device to a CPU mounted on a printed circuit board, includes a back plate mounted below the circuit board and a retainer. The back plate includes a plurality of posts extending upwardly through the circuit board and engaging with screws thereat. The retainer includes a mounting section attached to the heat dissipating device and a plurality of spring locking sections extending radially from the mounting section. The locking sections are downwardly pressable to engage with the respective posts and screws whereby the retainer mounts the heat dissipating device to the electronic component.
申请公布号 US7218524(B2) 申请公布日期 2007.05.15
申请号 US20040954316 申请日期 2004.09.30
申请人 FOXCONN TECHNOLOGY CO., LTD. 发明人 YU GUANG;LEE TSUNG-LUNG
分类号 H05K7/20;F28F7/00;H01L23/34 主分类号 H05K7/20
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