发明名称 |
Wiring board and process for producing the same |
摘要 |
A wiring board with microstrip structure has: a first conductor layer that is provided with conductor wirings to be connected to a semiconductor chip in its external terminal (bonding pad); a second conductor layer that is provided with a conductor pattern connected through a via to a ground wiring, for supplying a power supply of ground potential to the semiconductor chip; and a third conductor layer that is provided with a power supply terminal connected through a via to a power supply wiring for supplying an operation power supply of a potential other than the ground potential to the semiconductor chip, a signal terminal connected through a via to a signal wiring for transmitting an electric signal, and a ground terminal connected through a via to the conductor pattern in the second conductor layer.
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申请公布号 |
US7217370(B2) |
申请公布日期 |
2007.05.15 |
申请号 |
US20050073615 |
申请日期 |
2005.03.08 |
申请人 |
HITACHI CABLE, LTD. |
发明人 |
SUGIMOTO HIROSHI;OHTAKA TATSUYA;TAKAHAGI SHIGEHARU |
分类号 |
B23K26/00;H01B13/00;B23K26/38;B23K101/42;H01L23/12;H01L23/498;H01L23/50;H05K1/02;H05K1/11;H05K3/00;H05K3/06;H05K3/46 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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