发明名称 Silicon carbide semiconductor device and method for fabricating the same
摘要 An inventive semiconductor device is provided with: a silicon carbide substrate 1; an n-type high resistance layer 2; well regions 3 provided in a surface region of the high resistance layer 2; a p<SUP>+</SUP> contact region 4 provided within each well region 3; a source region 5 provided to laterally surround the p<SUP>+</SUP> contact region 4 within each well region 3; first source electrodes 8 provided on the source regions 5 and made of nickel; second source electrodes 9 that cover the first source electrodes 8 and that are made of aluminum; a gate insulating film 6 provided on a portion of the high resistance layer 2 sandwiched between the two well regions 3; a gate electrode 10 made of aluminum; and an interlayer dielectric film 11 that covers the second source electrodes 9 and the gate electrode 10 and that is made of silicon oxide.
申请公布号 US7217954(B2) 申请公布日期 2007.05.15
申请号 US20040801606 申请日期 2004.03.17
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 KUSUMOTO OSAMU;KITABATAKE MAKOTO;TAKAHASHI KUNIMASA;YAMASHITA KENYA;MIYANAGA RYOKO;UCHIDA MASAO
分类号 H01L21/335;H01L31/0312;H01L21/04;H01L23/485;H01L29/24;H01L29/45;H01L29/76;H01L29/78;H01L29/808;H01L29/812;H01L29/94;H01L31/062 主分类号 H01L21/335
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