| 摘要 |
Method for connecting an integrated circuit to a substrate and corresponding circuit arrangement The present invention provides a method for connecting an integrated circuit (C 1 ), in particular a chip or a wafer or a hybrid, to a substrate (C 2 ), which has the following steps: provision of a first electrical contact structure (KF 1 , BP, LB; KF 1 , BP') on a first main area (HF 1 ) of the integrated circuit (C 1 ); provision of a corresponding second electrical contact structure (KF 2 ) on a second main area (HF 2 ) of the substrate (C 2 ); at least one of the contact structures, the first electrical contact structure (KF 1 , BP, LB; KF 1 , BP') or the second electrical contact structure (KF 2 ), being elastic; placement of the first electrical contact structure (KF 1 , BP, LB; KF 1 , BP') onto the corresponding second electrical contact structure (KF 2 ), so that both are in electrical contact and under mechanical compression pressure (P); and connection of a region of the main area (HF 1 ) surrounding the first electrical contact structure (KF 1 , BP, LB; KF 1 , BP') to a corresponding region surrounding the second electrical contact structure (KF 2 ) of the second main area (HF 2 ) by an adhesive layer (KS), so that the first electrical contact structure (KF 1 , BP, LB; KF 1 , BP') and/or the second electrical contact structure (KF 2 ) are compressed in the connected state. The invention likewise provides a corresponding circuit arrangement.
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