发明名称 Semiconductor device and method of manufacturing the semiconductor device
摘要 In a method of manufacturing a semiconductor device to improve structural stability of a semiconductor device in a silicidation process, a substrate is provided to have an active region defined by an isolation layer. An etching mask is formed on the active region and the isolation layer to have a silicidation prevention pattern that at least partially exposes the active region. A gate structure is formed on the exposed active region. A gate spacer is formed on a sidewall of the gate structure positioned on the silicidation prevention pattern. Source/drain regions are formed on the active region using the gate spacer as a mask to thereby form the semiconductor device. Since voids may not be generated in a transistor of the semiconductor device or intrusion of the transistor may be prevented in the silicidation process, the semiconductor device including the transistor may have improved reliability and electrical characteristics.
申请公布号 US7217622(B2) 申请公布日期 2007.05.15
申请号 US20040024252 申请日期 2004.12.28
申请人 SAMSUNG ELECTRONICS CO., LTD 发明人 MAEDA SHIGENOBU;KIM YOUNG-WUG
分类号 H01L21/336;H01L21/76;H01L21/84;H01L29/78;H01L29/786 主分类号 H01L21/336
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