发明名称 |
RADIATOR PLATE AND SEMICONDUCTOR DEVICE |
摘要 |
A radiator plate 20 is mounted on a back surface of a semiconductor element 11 on a substrate 10 so that heat is radiated from the semiconductor element 11 . The radiator plate 20 includes first radiating fins 20 b formed on the one side which is opposite to the surface facing the substrate 10 and second radiating fins 20 c formed on the other side which faces the substrate 10 . The second radiating fins 20 c are arranged in the same direction as the first radiating fins 20 b and at positions not interfering the semiconductor element 11. |
申请公布号 |
KR20070050384(A) |
申请公布日期 |
2007.05.15 |
申请号 |
KR20060110815 |
申请日期 |
2006.11.10 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
AOKI SHUZO;UEHARA SUMIO;CHIN MEISOU |
分类号 |
H01L23/36;H01L23/34 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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