Tape package having test pad on reverse surface and method for testing the same

摘要

A tape package in which a test pad is formed on a reverse surface is provided. The test pad is disposed on a reverse surface of a base film through a through hole of the base film. Accordingly, shapes of the test pads are standardized so that a universal probe card can be used. A pitch between the test pads is wide so that the accuracy in an electric test of the tape package is increased. A total length of the tape package is reduced.